发明名称 Substrate holding apparatus
摘要 A substrate holding apparatus can accurately control temperature of a substrate in a direct manner with a relatively simple arrangement. The substrate holding apparatus has a top ring configured to hold a substrate to be polished and press the substrate against a polishing surface and an air bag attached to the top ring so as to be brought into contact with a rear face of the substrate. The substrate holding apparatus also has a regulator operable to regulate a temperature control fluid to be supplied into the air bag and a flow regulating valve operable to regulate a flow rate of the temperature control fluid discharged from the air bag.
申请公布号 US2005208880(A1) 申请公布日期 2005.09.22
申请号 US20050082729 申请日期 2005.03.18
申请人 发明人 SAITO KOJI;SAMESHIMA KATSUMI
分类号 B24B41/047;B24B37/00;B24B37/015;B24B37/04;B24B37/30;B24B41/06;B24B49/00;B24B49/14;H01L21/304;(IPC1-7):B24B49/00 主分类号 B24B41/047
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