ELECTRONIC DEVICE WITH STRESS RELIEF ELEMENT

摘要

The present invention relates to an electronic device whose component body contains a substrate and circuit elements placed on the substrate. An example embodiment contains at least one stress relief element (4), a substrate (1) with an upper surface and side walls at least one circuit element (2) located on said substrate (1) and at least one passivation layer (3) placed on said substrate (1), whereby said isolating layer (3) covers said at least one circuit element (2) and/or said substrate (1) and contains a top surface, at least one outer side surface which is located towards a side wall of said substrate and at least one outer edge, which is formed by said top surface and said at least one outer side surface, wherein the at least one stress relief element (4) is made out of a ductile material. On the passivation layer (3), the ductile material contacts the upper surface of the substrate (1).