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发明名称
Halbleiterbaugruppe mit Halbleiterchip, gebildet unter Verwendung eines Halbleiters mit breitem Bandabstand als Basismaterial
摘要
申请公布号
DE10251247(B4)
申请公布日期
2005.09.22
申请号
DE2002151247
申请日期
2002.11.04
申请人
MITSUBISHI DENKI K.K., TOKIO/TOKYO
发明人
HIRAO, MASAYOSHI;SATOU, KATSUMI;TOOI, SHIGEO;MATSUO, KAZUSHIGE
分类号
H01L23/34;H01L21/52;H01L23/051;H01L23/36;H01L25/07;H01L25/18;(IPC1-7):H01L25/07
主分类号
H01L23/34
代理机构
代理人
主权项
地址
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