| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize concrete constitution of a transparent platen which is employed in actual CMP equipment. <P>SOLUTION: In the chemical mechanical polishing equipment, a polishing pad 5 is bonded on a surface, when used, and a rotating platen and a wafer-holding mechanism 8 which rotates, while holding, so that it presses a wafer 7 against the polishing pad are included, wherein the platen has a rib structure and includes an opaque base 12 fitted to a rotating shaft, and a transparent plate 11 which is mounted on the base and includes the transparent plate 11 having a circular flat surface. The surface of the transparent plate 11 can be observed from a lower side of the base 12. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
