| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin molding in which small pieces of embossed aluminum foil substrate having fine grooves (hereinafter referred to as small pieces of hologram foil) are mixed throughout a thermoplastic resin, and to provide the small pieces of hologram foil. SOLUTION: There are provided a resin molding in which small pieces of embossed aluminum foil substrate having fine grooves are mixed throughout a thermoplastic resin and small pieces of hologram foil. The small pieces of hologram foil are made of an aluminum foil substrate of which at least one surface has been embossed. COPYRIGHT: (C)2005,JPO&NCIPI
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