Ceria slurry for polishing semiconductor thin layer

摘要

A non-agglomerating ceria aqueous slurry, which has good dispersion stability and reduced generation of scratches with excellent polishing productivity, comprises ceria particles having a mean volume particle size ranging from 0.1 to 0.2 mum and is characterized in that when it is centrifuged under an applied average centrifugal force (g) of 1,970 g₀ for 2 minutes, g₀ being acceleration of gravity, the amount of the solid content reduction is 20% by weight or less.