| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing system that can improve the uniformity of the dimensions of resist patterns among wafers, by fixing wafer pulling and placing time, after exposure. <P>SOLUTION: The semiconductor manufacturing system generates exposure end time data, based on the exposing condition data read from a storage device 73 by means of the exposure end time data generating means 71 of an exposure system 70. Then the system transmits the generated exposure end time data to a coating and development device 20 by means of an exposure end time data transmitting means 72. In addition, the system temporarily stops a wafer transfer cycle, by means of a transfer cycle temporarily stop means 22, based on the exposure end time data received by a means of an exposure end time data receiving means 21; and, at the same time, causes a transfer device to stand by, in matching with the transfer of wafers from the exposure system 70. After the exposed wafer is transferred to a heating and cooling unit, the system resumes the temporarily stopped wafer transfer cycle, by means of a wafer transfer cycle resuming means 23. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
