| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive connection structure and a connecting method of an electronic component to a substrate capable of obtaining high connecting reliability and high density mounting, since stress generated by a temperature change or the like can be mitigated, and heat generated from the electronic component can be efficiently transferred and dissipated. SOLUTION: In the conductive connection structure 1, the electronic component 2 having a plurality of electrodes and the substrate 3 are connected by conductive connection by resin core conductive particles and metallic conductive particles. In this case, the resin core conductive particles are arranged in the electrode on the outer peripheral part of the electronic component and the metallic conductive particles are arranged in the electrode inside the electronic component. COPYRIGHT: (C)2005,JPO&NCIPI
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