发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 The invention seeks to provide a manufacturing method for an electro-optical device and semiconductor device which improve the shape of semiconductor layers in electro-optical devices and a semiconductor device having semiconductor layers with different thickness, enabling manufacturing with good yield. The manufacturing method comprises a patterning process for patterning a mono-crystalline silicone layer (semiconductor layer) 206 formed on a supporting substrate 10 with an insulating film 12 introduced therebetween into a predetermined two-dimensional shape and dividing the semiconductor layer 206 into a plurality of semiconductor regions 210 and 220, and a thin-layer formation process for performing thin-layer formation for forming the semiconductor layer 201 of a first semiconductor region 210, of the semiconductor regions 210 and 220 formed by the patterning process, to have a predetermined semiconductor layer thickness. <IMAGE>
申请公布号 KR100516616(B1) 申请公布日期 2005.09.22
申请号 KR20030019036 申请日期 2003.03.27
申请人 发明人
分类号 G02F1/1345;H01L29/786;G02F1/1362;G02F1/1368;H01L21/77;H01L21/84;H01L27/12;H01L29/06;(IPC1-7):H01L29/786 主分类号 G02F1/1345
代理机构 代理人
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