发明名称 GOLD PLATING BATH
摘要 PROBLEM TO BE SOLVED: To provide a gold plating bath with which the precipitation of gold onto a resin is prevented when a printed circuit board or the like is subjected to gold plating. SOLUTION: The non-gold cyanide plating bath containing a water soluble gold salt and a complexing agent therefor, contains an aminothiazole derivative. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005256140(A) 申请公布日期 2005.09.22
申请号 JP20040072723 申请日期 2004.03.15
申请人 C UYEMURA & CO LTD 发明人 UCHIDA HIROKI;KISO MASAYUKI;FUJIURA HIROYUKI;NAKATANI SEIJI;TANABE KATSUHISA
分类号 C23C18/42;C25D3/48;C25D7/00;(IPC1-7):C25D3/48 主分类号 C23C18/42
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