发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To form an oxide film at a speed higher than in a prior art while avoiding the deterioration of homogeneity even for a large substrate and allowing an inexpensive glass substrate to be employed at a low cost. SOLUTION: A ECR plasma 111 is applied to the surface of a substrate 101 to form a state that activated oxygen has been irradiated, and a substrate 101 is formed in that state. Thereafter, the substrate 101 is put in a hydrogen gas atmosphere 120 and heated, for example, at 400°C. Heating the substrate in the hydrogen gas atmosphere 120 causes the extinguishment of a dangling bond or the like slightly present in the gate oxide film 102, thus improving the quality of the gate oxide film 102. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005260114(A) 申请公布日期 2005.09.22
申请号 JP20040072167 申请日期 2004.03.15
申请人 NIPPON TELEGR & TELEPH CORP <NTT>;NTT AFTY CORP 发明人 SAITO KUNIO;JIN YOSHITO;SHIMADA MASARU;KIUCHI MIKIHO
分类号 H01L21/316;H01L21/336;H01L29/78;H01L29/786;(IPC1-7):H01L21/316 主分类号 H01L21/316
代理机构 代理人
主权项
地址