| 摘要 |
Disclosed is a polishing apparatus comprising a rotating mechanism which rotates a semiconductor substrate having a treatable film deposited thereon, and a supply unit which supplies a chemical liquid to a polishing surface of the treatable film, the supply unit having an abrasive grain injection nozzle, an additive supply port, and a water supply port and being able to spray the chemical liquid onto at least one of the surfaces including the top surface, side surface, and bottom surface of the semiconductor substrate. |
