Compositions for preparing low dielectric materials containing solvents

摘要

Silica-based materials and films having a dielectric constant of 3.7 or below and compositions and methods for making and using same are disclosed herein. In one aspect, there is provided a composition for preparing a silica-based material comprising an at least one silica source, a solvent, an at least one porogen, optionally a catalyst, and optionally a flow additive wherein the solvent boils at a temperature ranging from 90°C to 170°C and is selected from the group of compounds represented by the following formulas: HO-CHR<Sup>8</Sup>-CHR<Sup>9</Sup>-CH<Sub>2</Sub>-CHR<Sup>10</Sup>R<Sup>11</Sup> where R<Sup>8</Sup>, R<Sup>9</Sup>, R<Sup>10</Sup> and R<Sup>11</Sup> can independently be an alkyl group ranging from 1 to 4 carbon atoms or a hydrogen atom; and R<Sup>12</Sup>-CO-R<Sup>13</Sup> where R<Sup>12</Sup> is a hydrocarbon group having from 3 to 6 carbon atoms; R<Sup>13</Sup> is a hydrocarbon group having from 1 to 3 carbon atoms; and mixtures thereof.