| 发明名称 |
CHIP PACKAGE SEALING METHOD |
| 摘要 |
<p>A packaging method including assembling components on a substrate, manufacturing a lid assembly to include a plurality of integrated covers, and mating the lid assembly to the substrate.</p> |
| 申请公布号 |
EP1576652(A2) |
申请公布日期 |
2005.09.21 |
| 申请号 |
EP20030761111 |
申请日期 |
2003.06.19 |
| 申请人 |
FOSTER-MILLER, INC. |
发明人 |
FARRELL, BRIAN;JAYNES, PAUL;TAYLOR, MALCOLM |
| 分类号 |
H01L21/50;H01L23/04;H01L23/06;H01L23/10;(IPC1-7):H01L21/00;H01L21/44 |
主分类号 |
H01L21/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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