发明名称 Hot melt adhesives
摘要 The invention provides a hot melt adhesive composition including a tubular reactor copolymer of ethylene and 5 to 20 mol % of comonomer units derived from an alkyl acrylate or alkyl methacrylate, wherein the copolymer has a melt index of at least 300 g/10 min. The alkyl group of the alkyl acrylate or alkyl methacrylate can be a linear or branched C<SUB>1 </SUB>to C<SUB>12 </SUB>group, particularly n-butyl. If desired, the hot melt adhesive can further include tackifiers, waxes, antioxidants and other desired additives. The hot melt adhesive composition shows improved heat resistance and favorable properties, such as has a shear adhesion fail temperature of at least 80° C., without the need to use high melting waxes. The invention further provides articles such as cartons, cases, trays, bookbindings or disposables including the hot melt adhesive compositions.
申请公布号 US6946528(B2) 申请公布日期 2005.09.20
申请号 US20040466454 申请日期 2004.02.03
申请人 EXXONMOBIL CHEMICAL PATENTS INC. 发明人 DOMINE JOSEPH D.;TANCREDE JEAN M.;PUGH SALLY Q.
分类号 C09J123/08;C08F210/02;C08F220/12;C08J5/00;C08L23/08;C08L33/08;C08L91/06;C08L93/04;C09J11/02;C09J11/08;C09J191/06;(IPC1-7):C08F2/00;C08G85/00 主分类号 C09J123/08
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