| 摘要 |
FIELD: computerization engineering; cooling heat-liberating electronic components of computers. ^ SUBSTANCE: proposed cooler is made in form of plate stack provided with coolant supply and discharge passages; plate stack consists of plate-base made from material possessing high heat conductivity and plate-cover consisting of at least one part; inner surface of plate base has recesses; plate-cover has coolant passages made in form of bow-shaped cavities which are located from its outer diameter towards center in such way that walls of passages extend to upper plane of plate-base and cross recesses made in it. ^ EFFECT: simplified structure; low cost of manufacture; enhanced efficiency of heat pick-up from computer elements. ^ 5 dwg |
