发明名称 MANUFACTURING METHOD OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide the manufacturing method of an electronic component which reduces the occurrence frequency of nonconforming articles and increases yield by preventing tears of a sealing member. SOLUTION: When the temperature of the heating furnace 10 of a closed system is elevated, the temperature of the inside 10A of the furnace and the temperature of air gap portions 5a, 5b rise with almost the same pattern as the temperature curve, because the inside 10A and the outside 10B of the furnace are blocked. Due to this reason, volume V1 of the gas in the air gaps 5a, 5b and volume V2 of the gas of the inside 10A of the furnace expand at almost the same rate, by which the difference between the atmospheric pressure P1 in the air gaps 5a, 5b and the atmospheric pressure P2 of the inside 10A of the furnace is reduced. Accordingly, expansion of the sealing member 6 by the difference in the atmospheric pressure is suppressed, by which the tear of the sealing member 6 is prevented. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005252046(A) 申请公布日期 2005.09.15
申请号 JP20040061683 申请日期 2004.03.05
申请人 ALPS ELECTRIC CO LTD 发明人 SASAKI HITOSHI;TAKEUCHI HIDEAKI;KONDO HIDEKI
分类号 H01L23/02;H03H3/08;(IPC1-7):H01L23/02 主分类号 H01L23/02
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