| 摘要 |
A molding pin for a metal die is prevented from breaking, solder is surely deposited, and thus, a circuit pitch can be reduced to the limit. On the front plane of a circuit board (2), prescribed circuit patterns (3) made of a conductive material are formed, and on the rear plane, the prescribed circuit patterns are also formed. On the circuit board (2), a through hole (5) is formed to carry electricity between the circuit patterns on the both planes. The inner shape of the through hole is narrow in a direction between the adjacent circuit patterns (3) and wide in a circuit extending direction. |
