发明名称 |
METHOD FOR MANUFACTURING LAMINATED CERAMIC ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated ceramic electronic component which has neither a structural defect nor a cutting defect and has high reliability. SOLUTION: When a laminated ceramic capacitor 10 is manufactured, a specified ceramic green sheet among a plurality of ceramic green sheets containing a binder is coated with conductive paste containing a binder having a higher softening point than the binder in the ceramic green sheet to form an internal electrode pattern. Those ceramic green sheets are stacked to form a laminate. The laminate is pressed and bonded while heated at temperature above the softening point of the binder in the ceramic green sheet and the softening point of the binder in the conductive paste. The pressed laminate while heated at temperature above the softening point of the binder in the conductive paste is pressed with pressure less than the pressure during the press bonding and then cut to a specified size to form unburnt elements. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005252098(A) |
申请公布日期 |
2005.09.15 |
申请号 |
JP20040062680 |
申请日期 |
2004.03.05 |
申请人 |
MURATA MFG CO LTD |
发明人 |
UENO YASUSHI;MATSUMOTO HIROYUKI;YAMADA KENICHI |
分类号 |
H01G4/12;H01G4/30;(IPC1-7):H01G4/12 |
主分类号 |
H01G4/12 |
代理机构 |
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