BONDING STRUCTURE AND JOINING METHOD BETWEEN FILM-LIKE ELECTRONIC COMPONENT AND TERMINAL PART

摘要

PROBLEM TO BE SOLVED: To realize high reliable bonding by a simple process and enable visual observation of inspecting a joint portion in a bonding structure and a joining method between a film-like electronic component and a terminal component.

SOLUTION: The film-like electronic component 1 comprises an electrode pattern 12 for external connection which is formed on a front surface of a substrate 11, an end P for connection formed by extending the electrode pattern 12 to a substrate end, and a metal film 13 formed on an end surface of the substrate 11 which is conducted with the end P for connection electrically. A terminal component 2 comprises the electrode pattern 12 integrally formed on a substrate 21 consisting of insulator. The film-like electronic component 1 is arranged by positioning the end P for connection on the metal terminal 22 of the terminal component 2 in such a manner that the electrode pattern 12 is arranged upwards, and the electrode pattern 12 and the metal terminal 22 are connected by an electrically conductive material 4 in the substrate end including the end P for connection and the metal film 13.

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