发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To realize high-speed operation, low power consumption and stable operation by diminishing the parasitic capacity and prevention of the generation of a floating node, when reducing the finishing size unevenness of a gate electrode, utilizing a dummy gate. SOLUTION: The finishing size unevenness is reduced by a step using the dummy gate 108, and a gate electrode 102 is formed. Then, after a first interlayer insulating film 105 is formed, the part of the first interlayer insulating film 105 is removed, and further, the dummy gate 108 is removed. A second interlayer insulating film 106 of lower dielectric constant than the first interlayer insulating film 105 is formed on a region, in which the dummy gate 108 and the part of the first interlayer insulating film 105 are removed. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005251896(A) 申请公布日期 2005.09.15
申请号 JP20040058660 申请日期 2004.03.03
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TAMARU MASAKI
分类号 H01L21/768;H01L21/3205;H01L21/8238;H01L23/52;H01L23/522;H01L27/092;H01L27/108;H01L29/78;(IPC1-7):H01L29/78;H01L21/320;H01L21/823 主分类号 H01L21/768
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