| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrode structure of plating equipment capable of forming a plating film of a uniform film thickness over the entire surface of a substrate to be plated, like a semiconductor wafer. SOLUTION: The electrode structure of the plating equipment has the substrate to be plated, a substrate gripper which grips the substrate and is supplied with an electroplating solution within a flat tray-shaped spacing formed of the gripper and the substrate, an in-liquid immersing body for reducing the volume of the electroplating solution to be immersed into the electroplating solution, a counter electrode which is arranged opposite to the substrate on the in-liquid immersing body apart a prescribed spacing therefrom, and an energizing electrode which is arranged on the peripheral surface of the substrate. The diameters of the in-liquid immersing body and the counter electrode are the same as or greater than the effective diameter of the in-liquid substrate and the feed contact of the energizing electrode to the substrate to be plated is installed at the end of the substrate gripper in the electroplating solution and is connected to the circumferential end on the inner side of the substrate to be plated. COPYRIGHT: (C)2005,JPO&NCIPI
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