CIRCUIT ARRANGEMENT PLACED ON A SUBSTRATE AND METHOD FOR PRODUCING THE SAME

摘要

The invention relates to a circuit arrangement (1) placed on a substrate (2) and comprising at least one semiconductor component (3) arranged on the substrate and having at least one electrical contact surface (31) and at least one connection line (4) also arranged on the substrate and used to electrically contact the contact surface of the semiconductor component. Said circuit arrangement is characterised in that the connection line (4) forms part (51) of a discrete, passive electrical component (5) arranged on the substrate (2). The electrical contacting of the contact surface (31) of the semiconductor component is carried out during a step of the process and the part (51) of the discrete, passive electrical component (5) is produced. To this end, especially a film consisting of an electrically insulating material is applied to the semiconductor component (3) embodied as a power semiconductor and to the substrate (2) under a vacuum, and the contact surface of the power semiconductor is then bared. Furthermore, the connection line (4) is produced, whereby the electrical contacting of the contact surface (31) of the semiconductor component is carried out and the part (51) of the discrete, passive electrical component is produced.