发明名称 THERMOSETTING RESIN COMPOSITION, PREPREG, AND LAMINATE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition flame-retarded without using any halogen-containing flame retardant, excellent in heat resistance, and coping with an environmental problem, to provide a prepreg, and to provide a laminate using the prepreg. SOLUTION: The thermosetting resin composition is one comprising (a) an epoxy resin, (b) a curing agent, and (c) highly heat-resistant aluminum hydroxide having a 1% weight loss temperature of 250°C or higher, wherein 50 to 200 pts.wt. highly heat-resistant aluminum hydroxide (c) is present per 100 pts.wt. organic resin solids of the thermosetting resin composition. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005247889(A) 申请公布日期 2005.09.15
申请号 JP20040056058 申请日期 2004.03.01
申请人 HITACHI CHEM CO LTD 发明人 SUGAWARA IKUO;IKEDA KENICHI;KATO AKIRA;OSE MASAHISA;SHIMAOKA SHINJI;SUGANO TOMOYOSHI;FUKUDA TOMIO;KOBAYASHI KAZUHITO;MIYATAKE MASATO
分类号 C08J5/24;B32B15/08;B32B15/092;C08K3/22;C08L63/00;H05K1/03;(IPC1-7):C08L63/00 主分类号 C08J5/24
代理机构 代理人
主权项
地址