| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that can suppress the malfunction of a semiconductor element caused by the outward protrusion of a second bonding material which bonds the semiconductor element to a third metallic body from the main electrode of the element at the time of bonding. SOLUTION: The semiconductor device is provided with the semiconductor element 1, a first metallic body 3 provided on the rear surface 2 side of the element 1, and a second metallic body 5 provided on the surface 4 side of the element 1. The device is also provided with the third metallic body 6 between the element 1 and second metallic body 5. The size of the main surface 21 of the third metallic body 6 facing the semiconductor element 1 is made equal to or smaller than that of the main electrode 11 of the element 1. In addition, slits (grooves) 6a are provided on the side faces 23 of the third metallic body 6 from the surface 21 of the body 6 facing the main electrode 11 of the element 1 to the surface 22 of the body 6 on the opposite side so as to prevent the outward protrusion of the second bonding material by accumulating the second bonding material which becomes excessive at a bonding time in the slits (grooves) 6a. COPYRIGHT: (C)2005,JPO&NCIPI
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