| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thinner bonding shape and method by eliminating the load in the case of bonding or from an upper surface of a device, when bonding a semiconductor device and an external devices, taking measures to cope with electrical abnormalities or mechanical abnormalities of the semiconductor device or external device, and eliminating the thickness of the semiconductor device or external device itself. <P>SOLUTION: When bonding a semiconductor device 1 and an external device 7, the semiconductor device 1 is cut by a dicing cutter 6 along with a bump 5 on a semiconductor electrode 2, a side face of the semiconductor device 1 with a semiconductor circuit formation plane as a principal surface and a side face portion of the external device 7 are made to face, and an exposed portion side face of the semiconductor electrode 2 formed in a terminal portion on the principal surface of the semiconductor device 1 and the exposed portion side face of an external electrode 8 formed on a principal surface of the external device 7 are bonded and made to be electrically continuous by an adhesive 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
