| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing which can work inexpensively the air gap of the outer periphery of a substrate in which a plurality of printed boards are disposed by using a Thomson die. SOLUTION: The method of manufacturing a printed substrate in which a plurality of flexible circuit boards each having an air gap on the outer periphery are disposed includes the step of forming the Thomson die in which a plurality of Thomson dies are provided together in the air gap. Further, the method further includes a step of providing a substantially circular through holes previously at both the ends of the air gap. COPYRIGHT: (C)2005,JPO&NCIPI
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