| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a repair method and a repair tool capable of reducing the number of chipping-off operations in chipping off a pattern including inorganic particles and resin and capable of suppressing generation of serious defects in a later process and products due to scattering of chips and chipping of the repair tool. <P>SOLUTION: In this repair method, foreign matters or an excessive part 1 of the pattern is removed from the pattern at least including inorganic particles and resin. After repair liquid 2 including at least solvent is adhered to a portion 3 of the pattern to be removed, the portion 3 to be removed is chipped off. This repair tool is used for removing the foreign matters or the excessive part 1 of the pattern from the pattern at least including inorganic particles and resin, and at least a portion contacting with the portion 3 of the pattern to be removed is made of ceramics. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
