SUBSTRATE PROCESSOR AND SUBSTRATE PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a substrate processor where the surface of a substrate can be etched while the surface of the substrate is kept clean.

SOLUTION: The substrate processor 1 is provided with a stage 2 for almost horizontally holding a wafer W, a laser beam irradiation device 3 generating a laser beam L and irradiating it, and a plate-like transmission member 4 which is formed of quartz and through which the laser beam L can transmit. The transmission member 4 can be arranged in parallel to the wafer W held by the stage 2 in such a way that the laser beam L from the laser beam irradiation device 3 can transmit it. A substrate facing face 4a being one surface of the transmission member 4 is closely confronted with the wafer W. A resist film R is formed on one surface of the wafer W as the object of a processing. The substrate facing face 4a forms an acquisition face to which particles P generated by irradiation of the laser beam L on the resist film R as an object of removal are stuck and caught.

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