| 摘要 |
PROBLEM TO BE SOLVED: To provide such a carrying device for a manufacturing apparatus a single chamber that can prevent flowing out of a corrosive gas, realize low cost and small footprint, and improve throughput. SOLUTION: The carrying device is used to carry in and take out a substrate to be processed in a single-wafer-processing type semiconductor processing apparatus wherein processing is performed in a vacuum environment. It is provided with a first buffer 10 wherein one substrate is placed and lifted/lowered, a load locking chamber 1 wherein the substrate is delivered between the outside of the carrying device and itself, a processing chamber 2 wherein the surface of the substrate is treated, and a carrying chamber 3 equipped with a horizontal articulated robot 7 wherein the substrate is carried to the load locking chamber 1 and the processing chamber 2. The carrying chamber 3 is provided with a second buffer 11 wherein two substrates are placed in the operation range of the robot 7 and lifted/lowered. COPYRIGHT: (C)2005,JPO&NCIPI
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