| 摘要 |
PROBLEM TO BE SOLVED: To melt a solder inside an element again by controlling a temperature rise of the element itself in a wiring operation, such as mounting the element on circuit substrate or detaching it from the element substrate. SOLUTION: The sheet (1), to be mounted between the element substrates, is mounted between the circuit element and the circuit substrate with a terminal located on the bottom to connect the terminal and the circuit substrate, has insulation characteristics, and is equipped with a heat-conductive insulating layer (11) which has an insulating characteristic and heat conductivity, enabling the solder to melt by applying the heat and is equipped with an adiabatic insulating layer (12), which is laminated, as the surrounding of the heat-conductive insulating layer (11) remains on the upper layer of the the heat-conductive insulating layer (11), and has insulating characteristics, and can insulate the heat applied to the heat-conductive insulating layer (11). The sheet is constructed so that the terminal of the circuit element, located on the upper surface of the adiabatic insulating layer (12) is held and a conducting hole (13) which conducts the terminal to the circuit substrate, located on the lower surface of the heat-conductive insulating layer (11), is located. COPYRIGHT: (C)2005,JPO&NCIPI
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