| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic substrate, semiconductor device housing package and its manufacturing method in which bonding reliability of a semiconductor device can be improved. SOLUTION: In a ceramic substrate 10 brazed onto a heatsink board 11, the bonding portion of the ceramic substrate 10 with the heatsink board 11 includes a previously fused and stuck Ag-Cu wax film 14. Furthermore, in a semiconductor device housing package 20 in which the heatsink board 11 and the frame-like ceramic substrate 10 are brazed and bonded, and which includes a cavity 16 for mounting a semiconductor device 15 on the heatsink board 11, an Ni plate coating 13 on a surface of a metallize film 12 formed in the bonding portion of the ceramic substrate 10 with the heatsink board 11 includes a previously fused and stuck Ag-Cu wax film 14, and the Ag-Cu wax film 14 is fused again, thereby bonding the ceramic substrate 10 onto the heatsink board 11. COPYRIGHT: (C)2005,JPO&NCIPI
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