FILM-LIKE COMMODITY AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a new integrated circuit, having a configuration which would not impair the desinability of business cards.

SOLUTION: A thin-film integrated circuit is mounted on the film-like commodity. An IDF chip has a semiconductor film with a thickness that is 0.2 μm or smaller as an active region, thus reducing the film thickness as compared with a chip formed by a silicon wafer. In addition, the thin-film integrated circuit can have light transmission properties, which differs from a chip formed from a silicon wafer.

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