NESTED DESIGN APPROACH

摘要

A structure for a system of chip packages includes a master substrate (2A) and at least one subset substrate (2B) of the master substrate (2A). The subset substrate (2A) includes a portion of the master substrate (2A) that has an identical pin out pattern as the portion of the master substrate (2A). The subset substrate (2B) has identical internal net lists as the portion of the master substrate (2A). The subset substrate (2B) is adapted to accommodate a smaller chip than the master substrate (2A). The master substrate (2A) is the largest substrate in the system. The invention also prepares a system of chip packages. The invention selects a master substrate (2A) and then selects a subset substrate (2B) of the master substrate (2A).