发明名称 EXPANSION METHOD AND DEVICE
摘要 An adhesive sheet (S) is expanded by expanding means (20) with a plate-like article (W) being mounted to a frame (F) after dicing of the plate-like article (W) to increase spacings between individual chips (T), an expanded state of the adhesive sheet (S) is maintained by expansion maintaining means (10), so that the plate-like article (W) is able to be conveyed together with the frame (F) with the spacings between the chips (T) being maintained, thereby preventing adjacent chips (T) from interfering with each other during the conveyance. This allows the plate-like article (W) after the dicing to be conveyed together with the frame (F) without edges of the adjacent chips (T) coming into contact with each other by vibration during the conveyance to cause chipping or microcracks in the edges. <IMAGE>
申请公布号 EP1575081(A1) 申请公布日期 2005.09.14
申请号 EP20030758938 申请日期 2003.10.27
申请人 TOKYO SEIMITSU CO.,LTD. 发明人 KUBO, YUICHI;OSADA, MASATERU;AZUMA, MASAYUKI;SAKAYA, YASUYUKI;ARAI, YUUSUKE;TAMAKI, TOMOHIRO
分类号 H01L21/00;H01L21/301;H01L21/68;(IPC1-7):H01L21/301;H01L21/52 主分类号 H01L21/00
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