| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus in which a piping structure is simple and a sufficient processing is realized on a surface and a backside of a substrate. SOLUTION: A plurality of screw pins 13 are arranged on a periphery corresponding to the outer shape of a wafer W at almost equal intervals in the upper face peripheral edge of a spin base 12, and they are disposed so that they can rotate around center axes along a vertical direction. Grooves 131 in width corresponding to thickness of the wafer W are spirally formed on peripheral faces of the screw pins 13. The wafer W is lowered or raised, and the wafer W can be immersed in processing liquid stored in a processing liquid storage 23 of a cup 2 or can be extracted from processing liquid. COPYRIGHT: (C)2005,JPO&NCIPI |
