| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer board by which the thermal shock of a hot plate is relaxed to prevent the multilayer board molded near the hot plate from being warped. SOLUTION: A metallic foil 4 is overlaid on a core material 2 having an inner layer circuit 1 by means of a pre-preg 3 to form a laminate 5, and a number of double-side metal foil-clad laminated sheet laminates 5 and forming plates 6 are alternately overlaid to form a combination 7, and then the combination 7 is heated and pressed by the hot plate 15 with a cushion material 8 in between, thereby making the core material 2, the pre-preg 3 and the metallic foil 4 to be integral as one body. In such the method for manufacturing a multilayer board, a double-side metal foil-clad laminated sheet 9 and a metal sheet 10 are overlaid to form a thermal shock absorbing material 11. The thermal shock absorbing material 11 is arranged between the cushion material 8 and the combination 7, and the combination 7 is heated and pressed by the hot plate 15. The thermal shock can be relaxed by the thermal shock absorbing material 11. COPYRIGHT: (C)2005,JPO&NCIPI |
