| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent an unfavorable influence caused by a residual droplet after treatment such as cleaning treatment, in substrate equipment which supplies a treatment liquid to the lower face of a rotating substrate and applies predetermined treatment such as the cleaning to the lower face. SOLUTION: A liquid pool P is formed immediately after rinsing treatment between the central portion of the lower face of a wafer W and the end of a nozzle 29 (a nozzle opening 30b and an entire upper face 30a of a blocking member 30), by which the droplet L remaining and adhered to the central portion of the lower face of the wafer W and the end of the nozzle 29 is entrapped in the liquid pool P. Moreover, the residual droplet L is removed from the central portion of the lower face of the wafer W and the end of the nozzle, together with the liquid pool P, by sucking and removing the liquid pool P. In this case, as the opening dimension of a nozzle opening 30b becomes larger toward the direction of the end of the nozzle, the liquid pool P is stably formed and removed by suction. COPYRIGHT: (C)2005,JPO&NCIPI
|
