发明名称 Method for compensation of the shortening of line ends during the formation of lines on a wafer
摘要 In order to compensate for the shortening of line ends ( 30 ) in a circuit design of an integrated circuit, in a first step, hammerheads or serifs ( 50 ) are attached to the line ends ( 30 ) by means of rule-based OPC corrections. The line ends modified in this way are revised further by downstream application of a simulation-based OPC correction before mask or direct wafer writer data are calculated. As a result of the formation of the pattern revised by the simulation-based correction on the wafer, there actually arises in an approximate manner owing to the proximity effects the layout created by the rule-based correction with the supplemented line ends ( 30 ) on the wafer.
申请公布号 US2005196686(A1) 申请公布日期 2005.09.08
申请号 US20050066734 申请日期 2005.02.25
申请人 MEYER DIRK;HENKEL THOMAS;THIELE JORG;KECK MARTIN 发明人 MEYER DIRK;HENKEL THOMAS;THIELE JORG;KECK MARTIN
分类号 G03F7/20;G03F9/00;(IPC1-7):G03F9/00 主分类号 G03F7/20
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