| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of easily connecting two wafers as easily as possible, and to provide a wafer product. SOLUTION: In a method for mutually connecting two wafers 11 and 12, both wafers are laminated with each other, thereby forming a contact region 15 between both wafers, and the contact region is heated, by limiting the contact region locally and in time. In a locally limited heating, important heating of the wafer is limited in a direction parallel to the contact region or in a direction vertical thereto, or preferably in the both direction. The method is especially suitable for processing components which tend to be affected by temperature. COPYRIGHT: (C)2005,JPO&NCIPI
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