发明名称 HEATING/COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heating/cooling device which does not use a transfer arm or the like for transfer from a heating room to a cooling room. SOLUTION: In the heating/cooling device 38 for heating/cooling a disk substrate transferred by a holding and feeding means having a plurality of screw shafts 44 in a heating room 41/cooling room 42, the screw shafts 44 of the holding and feeding means 50 are disposed over the heating and cooling rooms 41 and 42. On the surface of a part of the screw shaft 44 positioned in a cooling part, a heat radiation layer 59 is formed to expedite the cooling of the screw shaft 44 increased in temperature by a heating part. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005243224(A) 申请公布日期 2005.09.08
申请号 JP20050023440 申请日期 2005.01.31
申请人 KITANO ENGINEERING CO LTD 发明人 KITANO RIYOUKO;TSURUHA MASAYUKI;IKEUCHI NORIYUKI;NAKAGAWA YOICHI;SHINOHARA TOSHINORI
分类号 G11B7/26;H01L21/677;H01L21/68;(IPC1-7):G11B7/26 主分类号 G11B7/26
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