发明名称 |
Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquid |
摘要 |
A starting point for cleavage made up of at least one of a groove and a through hole is formed on a chip dividing line or a dicing line along the cleaved surface of a wafer. Liquid matter is injected into the starting point. Then, the liquid matter is changed by applying an external factor that changes the liquid matter physically. Making use of the change, the wafer is cleaved so as to divide the wafer into semiconductor chips. |
申请公布号 |
US2005196899(A1) |
申请公布日期 |
2005.09.08 |
申请号 |
US20050072331 |
申请日期 |
2005.03.07 |
申请人 |
SHIMIZU NORIKO;TAKYU SHINYA;KUROSAWA TETSUYA |
发明人 |
SHIMIZU NORIKO;TAKYU SHINYA;KUROSAWA TETSUYA |
分类号 |
H01L21/301;B28D5/00;H01L21/78;(IPC1-7):H01L21/301 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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