Process to produce microelectronic components by extreme ultraviolet lithography

摘要

An extreme ultraviolet lithography (EUV) process makes structures (34) in a resist layer (16) by application to the top and bottom (14) faces of a substrate (10) of an electromagnetic absorbent layer (12) operating in the EUV spectrum. The resist layer (16) is then exposed to EUV radiation, followed by development of the resist layer (16) into an appropriate structure.