发明名称 Manufacturing electronic assembly involves triggering chemical reaction in which supporting polymer is cross-linked and converted into duromer
摘要 <p>The method involves manufacturing an electronic assembly with a conducting film (3) with a conducting track structure (32) and a circuit carrier with a conducting track structure, whereby an anisotropic conductive adhesive (4) is provided to connect the film and circuit carrier and the adhesive has at least one supporting polymer containing statistically distributed electrically conductive particles. It involves triggering a chemical reaction in which the supporting polymer is cross-linked and converted into a duromer.</p>
申请公布号 DE102004008028(A1) 申请公布日期 2005.09.08
申请号 DE20041008028 申请日期 2004.02.19
申请人 CONTI TEMIC MICROELECTRONIC GMBH 发明人 HEINZ, HELMUT;JAHN, MICHAEL;SCHUCH, BERNHARD
分类号 H05K3/32;H05K3/36;(IPC1-7):H05K1/14 主分类号 H05K3/32
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