METHOD OF MANUFACTURING CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD

摘要

A method of manufacturing a capacitor-embedded PCB is disclosed wherein a RCC with a resin thickness of several tens of micrometers and another RCC or a PREPREG with a copper foil is used for the embedded capacitor. The present invention eliminates the problem of losing a thermal pad of the upper electrode or the ground pad during the etching step of the outer layer. The present invention makes it possible to minimize the manufacturing tolerance due to the reduction of the beam size of a laser drilling and thereby to increase work efficiency.