Diffusion bonding method for microchannel plates

摘要

A microchannel plate (MCP) ( 50 ) and a dielectric insulator ( 80 ) are deposited with a thin film ( 54, 84 ) using a suitable metal selected for optimum diffusion. The metallized MCP ( 50 ) and dielectric insulator ( 80 ) are then aligned and placed in a bonding fixture ( 36 ) that provides the necessary force applied to the components to initiate a diffusion bond. The bonding fixture ( 36 ) is then placed in a vacuum heat chamber to accelerate the diffusion bonding process between the MCP ( 50 ) and the dielectric insulator ( 80 ).