发明名称 Determining depth of recesses formed in supporting substrate involves recording and evaluating time profile of reduction in weight of substrate during evaporation of moistening substance
摘要 <p>The method involves applying an essentially uniform layer of moistening substance (3) to an area of the substrate (1) surface with recesses (2), recording a time profile of the reduction in weight of the substrate during evaporation of the substance, evaluating the time profile to determine a characteristic weight value when the substance has evaporated from the surface but the recesses are still filled with it and determining the depth (R) of the recesses taking into account the specific weight of the substrate without the substance, the density of the substance and the total area occupied by the recesses.</p>
申请公布号 DE102004007952(B3) 申请公布日期 2005.09.01
申请号 DE20041007952 申请日期 2004.02.18
申请人 INFINEON TECHNOLOGIES AG 发明人 TEMMLER, DIETMAR;WEIDNER, PETER
分类号 G01B21/18;G01G19/00;G01N5/04;G01N33/00;H01L21/66;(IPC1-7):H01L21/66 主分类号 G01B21/18
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