发明名称 LIQUID-COOLING TYPE COOLING PLATE
摘要 <p>A liquid-cooling type cooling plate 1 is equipped with at least one flat multi-bored tube 20, a substrate 10, and a cover plate 30. The substrate 10 has at its upper surface, two header forming dented portions 11a and lib arranged apart from each other and a tube accommodating dented portion 12 for accommodating the tube 20, the tube accommodating dented portion being formed between the header forming dented portions. An upper surface of the cover plate 30 and/or a lower surface of the substrate 10 is configured to be attached by a member to be cooled. The tube 20 is accommodated in the tube accommodating dented portion 12. The tube 20 is disposed between the substrate 10 and the cover plate 30. An opening of each header forming dented portion is closed by the cover plate 30, whereby two header portions 14a and 14b are formed. The substrate 10, the tube 20 and the cover plate 30 are integrally jointed.</p>
申请公布号 WO2005080902(A1) 申请公布日期 2005.09.01
申请号 WO2005JP03413 申请日期 2005.02.23
申请人 HONDA GIKEN KOGYO KABASHIKI KAISHA;SHOWA DENKO K.K.;AMANO, ATSUSHI;URUSHIHARA, KEISUKE;YAMAUCHI, SHINOBU;WAKABAYASHI, NOBUHIRO 发明人 AMANO, ATSUSHI;URUSHIHARA, KEISUKE;YAMAUCHI, SHINOBU;WAKABAYASHI, NOBUHIRO
分类号 F25D9/00;F28F3/12;H01L23/473;H05K7/20;(IPC1-7):F28F3/12 主分类号 F25D9/00
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