COOLING SYSTEM FOR DEVICES COMPRISING POWER SEMI-CONDUCTORS AND METHOD FOR COOLING SAID TYPE OF DEVICE

摘要

The invention relates to a cooling system (22) for devices comprising power semi-conductors (1) and methods for cooling said type of device. The cooling system also comprises circuit boards (4) which are arranged on a circuit support (10) in plug in contact strips (7). The cooling system itself comprises a cooling plate (11) which is mounted in a pivotable manner on one of the plug-in contact strips (7) in the region of the power semi-conductor components (1). Said cooling plate (11) can be pivoted about an axis (14) in such a manner that it takes a first position, which is pivoted away from the circuit board (4), and a second position wherein the cooling plate (11) rests on the power semi-conductor component (1).