METHOD FOR FORMING PLATING FILM, ELECTROMAGNETIC SHIELDING MATERIAL AND CASING

摘要

A method for forming a plating film is characterized in that a plating film is formed on the surface of a member composed of a synthetic resin material by sequentially performing a step for degreasing/cleaning the surface, a step for applying a primer coating material containing a catalyst to the surface, a step for forming a copper plating film thereon by nonelectrolytic plating, and a step for forming an antirust film thereon by a benzotriazole treatment. A plating process can be simplified by this method for forming a plating film. Also disclosed are an electromagnetic shielding material and a casing.